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Seoul, Korea on Mar 10, 2009

Seoul, Korea - March 10, 2009 : Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun using 40-nanometer (nm) process technology to produce an eight-gigabit (Gb) Flex-OneNAND™ fusion memory chip. Samsung’s Flex-OneNAND is a proprietary memory device that provides both SLC and MLC NAND in a single cost-efficient chip. It has been designed for applications that require high speed and high reliability in processing both code and data content.

Applications using Flex-OneNAND are expected to expand from high-performance smart phones today, to full HDTVs, IPTVs and other high-end applications by year end.

“The 40-nm Flex-OneNAND is a tremendous advancement for the memory industry, one which offers a uniquely cost-effective approach to memory selection, while permitting designers the flexibility of adjusting designs up to the final design stage,” said Jim Elliott, memory vice president, Samsung Semiconductor, Inc.

By adopting advanced 40nm class technology, Samsung achieves an increase in productivity of up to 180 percent over the first Flex-OneNAND, a 4Gb device designed on 60nm-class technology.

Developed in 2007, Flex-OneNAND incorporates SLC and MLC NAND on a single piece of silicon, allowing application designers to choose the portion of SLC and MLC NAND storage to be used in any particular design through a simple adjustment to the accompanying software. This maximizes the performance and efficiency of the embedded flash chip.

Samsung has included software to support a system level interface for embedded memory, moviNAND™ (or eMMC) in its 8Gb Flex-OneNAND. This new feature allows handset designers to easily introduce high-density embedded memory in their next generation phones, eliminating the need to source additional software. As embedded memory can increase high data transfer speeds, more high-end phones are expected to be introduced with from 1GB to even 32GB of embedded memory.

Flex-OneNAND’s MLC area provides up to a three times greater read speed and its SLC area offers up to a four times greater read speed than regular MLC NAND. The Flex-OneNAND MLC area features a comparable write speed to regular MLC NAND and its SLC area provides a write speed up to three times higher.

Flex-OneNAND reduces the area needed for the memory on the printed circuit board and improves performance by diminishing transmission noise.

Samsung also said it is expanding its collaboration with chipset designers to provide OEMs with added convenience in implementing innovative memory solutions such as Flex-OneNAND.

Seoul (Korea Newswire) March 05, 2009 08:39 AM — Intel Corporation today announced the 26 companies receiving Intel’s Preferred Quality Supplier (PQS) award for commitment to quality and performance excellence in 2008. These suppliers exceeded high expectations and tough performance goals to distinguish themselves from the thousands of suppliers that work with Intel.

Winners of the PQS award include:

AceCo Precision Manufacturing; Asyst Technologies, Inc.; Cisco Systems, Inc.; Dow Corning Corporation; FUJIFILM Electronic Materials; Ibiden Co., Ltd.; KES System & Service (1993) Pte Ltd.; Linde Electronics, a Member of the Linde Group; Murata Manufacturing Co., Ltd.; Nan Ya Printed Circuit Board Corporation; Nippon Mining & Metals Co., Ltd.; Praxair Electronics; Richtek Technology Corporation; Rofin-Baasel; Rosendin Electric; Securitas Security Services USA, Inc.; Senju Metal Industry Co., Ltd.; Skanska; Tektronix, Inc.; Thermal Product Solutions, a Division of SPX Corporation; Tokyo Electron Limited; TriQuint Semiconductor, Inc.; Tyco Electronics; Verizon Business; VWR International, LLC; and Xstrata Recycling, Inc.

“The standard by which companies are measured to be considered world-class quality continues to rise,” said Craig Brown, vice president of Intel’s Technology and Manufacturing Group and director of Materials. “Companies must not only achieve ever-improving traditional measures of product quality, but they must also understand and mitigate their impact on the environment. This year’s recipients of the Preferred Quality Supplier award have risen to this new level of challenge in their respective industries and have also shown their ongoing commitment to build an affordable, innovative and agile supply chain. We are pleased to work with these role models.”

“The excellence demonstrated by Intel’s top performing suppliers is truly remarkable,” said Robert Bruck, vice president of Intel’s Technology and Manufacturing Group and general manager of Technology Manufacturing Engineering. “The enduring commitment to industry-leading innovation, affordability and speed separates these suppliers from their peers and is critical to delivering increased value to our customers.”

The PQS award is part of Intel’s Supplier Continuous Quality Improvement program, which encourages suppliers to strive for excellence and continuous improvement. To qualify for PQS status, suppliers must score 80 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and responsiveness goals. Suppliers must manage and deliver on a challenging improvement plan and a quality/business systems assessment. Furthermore, the 2008 recipients demonstrated basic compliance to the Electronic Industry Code of Conduct and Intel’s Green Sustainability Program. Additional information about the SCQI program is available at supplier.intel.com/quality/scqi.htm.

Recognition events will be held in Tokyo and Santa Clara, Calif. this month to honor the PQS award winners. In addition, there will be an online advertisement launch and acknowledgement on Intel’s corporate Web site.

The PQS winners provide Intel with the following products and services:

AceCo Precision Manufacturing supplies fab spares and refurbishment
Asyst Technologies, Inc. supplies automated material handling systems
Cisco Systems, Inc. supplies networking hardware infrastructure, IP telephony and enterprise collaboration products
Dow Corning Corporation supplies electronic adhesives
FUJIFILM Electronic Materials supplies advanced chemistry and equipment for semiconductor device manufacturing
Ibiden Co., Ltd. supplies flip-chip substrate packages
KES System & Service (1993) Pte Ltd. supplies burn-in boards, TIUs, and BIB/TIU/UBID maintenance
Linde Electronics, a Member of the Linde Group, supplies ultra-high purity gases and chemicals and onsite services
Murata Manufacturing Co., Ltd. supplies multilayer ceramic capacitors, inductors, ferrite beads and wireless modules
Nan Ya Printed Circuit Board Corporation supplies substrates and printed circuit boards
Nippon Mining & Metals Co., Ltd. supplies sputtering targets for physical vapor deposition applications
Praxair Electronics supplies electronic process and bulk gases, sputtering targets and spare parts management
Richtek Technology Corporation provides power management solutions
Rofin-Baasel supplies laser mark equipment
Rosendin Electric provides electrical construction services
Securitas Security Services USA, Inc. provides security services
Senju Metal Industry Co., Ltd. supplies soldering materials
Skanska provides construction management
Tektronix, Inc. supplies validation test equipment
Thermal Product Solutions, a Division of SPX Corporation, supplies epoxy curing, IHS and pre-bake ovens
Tokyo Electron Limited supplies semiconductor production equipment
TriQuint Semiconductor, Inc. supplies amplifiers, RF switches and front end module for WLAN products
Tyco Electronics supplies CPU sockets, connectors and passive components
Verizon Business supplies network telecommunications and cellular services
VWR International, LLC provides distribution of global sourcing and supply chain management solutions
Xstrata Recycling, Inc. provides HVI component scrap processing

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

News Source: Intel

Seoul (Korea Newswire) March 06, 2009 08:53 AM — Intel Corporation Chairman Craig Barrett announced that his company is investing in a new academic research facility dedicated to high-performance computing (HPC) in France. 

The HPC lab initiative marks the start of a 5-year collaboration and is Intel’s first major investment in academic research in France. The four-party agreement signed today is a model of public-private partnership, linking Intel with government agencies and academia. 

“Research is vital to a country’s long-term economic health and competitiveness,” said Barrett, who was in Paris today to help launch the HPC laboratory. “By investing in innovation, including research and development, we make a commitment to accelerate the benefits of technology in France and in other parts of Europe.” 

Joining Intel in the effort, the Commissariat à l’Energie Atomique (CEA), a technological research organization funded by the French government, is contributing its expertise in HPC tera architecture and integration. France’s national HPC agency, Grand Equipement National de Calcul Intensif, will provide its scientific end user applications and feedback. The University of Versailles St Quentin en Yvelines will make technical contributions, such as multi-core performance evaluation and code optimization. 

“It is strategic for a public research institution like CEA to cooperate with a world-leading company such as Intel to prepare for the next generation of HPC facilities that the European scientific community and industrial companies expect,” said Bernard Bigot, CEA general administrator and High Commissioner. 

The joint research center will be built about 20 kilometers southwest of Paris in Île-de-France Teratec, a region home to universities and other scientific research facilities. Intended to be used primarily by university students in France and other European Union countries to address future HPC challenges, the lab will seek to accelerate R&D and innovation in Europe in keeping with the Intel Labs Europe (ILE) initiative announced earlier this year. 

The lab is being designed as an “exascale” high-performance computing center focused on hardware and software optimization. Exascale computing is a next-generation technology and refers to systems that can handle a million trillion calculations per second (1018). 

The HPC lab in France marks Intel’s first significant European R&D announcement since forming ILE in January. A key part of Intel’s commitment to collaborative research, ILE serves as a platform for future potential investments and advanced innovation activity in Europe. 

Before arriving in France, Barrett spent a day visiting Romania, and tomorrow he plans to travel to Serbia. Both visits are on behalf of the United Nations and the Intel World Ahead Program, which strives to improve education, health care, entrepreneurship and government services in developing countries worldwide by accelerating access to computers, connectivity and localized Internet content. Additional information is available at www.intel.com/changingtheworld and www.intel.com/intel/worldahead. 

Barrett also chairs the United Nations Global Alliance for Information and Communication Technologies and Development. 

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries. 

* Other names and brands may be claimed as the property of others.

News Source: Intel

Seoul (Korea Newswire) March 05, 2009 08:40 AM — Intel Corporation Chairman Craig Barrett today made an impassioned speech on education to Romanian university students, telling them that education and technology are key to creating an innovation economy. Barrett is also collaborating with government officials on ways to broaden the use of computers and other technology to enhance national education. 

“Integrating computers and education is essential in the 21st century,” said Barrett, who also chairs the United Nations Global Alliance for Information and Communication Technologies and Development. “The new technologies and trends that are transforming the global economy will influence the future of today’s students, both personally and professionally.” 

Barrett delivered his address at one of Romania’s most prestigious institutions of higher education. The nearly 200-year-old University Politehnica of Bucharest (UPB), with 26,000 students, is the country’s largest technical university. Speaking to students from information technology departments as well as professors from Bucharest universities, Barrett encouraged listeners to broaden their options for the future by learning as much as they can with the help of information and communications technology (ICT). 

In related events, UPB bestowed the honorary title of Doctor Honoris Causa on Barrett today during a special ceremony at the university. The honor recognizes Barrett’s intellectual merits, and is the highest degree that UPB awards to any individual. 

Barrett is also scheduled to meet with government officials today to discuss how Intel can support the Romanian government’s plan to strengthen its strategy for technology-assisted education. One existing effort is the Intel® Teach program, which is designed to enhance classroom learning by training teachers to integrate technology into the curriculum. Intel teamed with Romanian software developer SIVECO to help administer the training and expects that 35,000 Romanian teachers will complete the Intel Teach program in the coming years. 

The Intel chairman planned to end his day with the local American Chamber of Commerce at a forum at the National Museum of Art of Romania. Barrett is expected to talk about how Romania can take advantage of ICT to be competitive as one of the newest members of the European Union. He believes investments in ICT infrastructure deployment such as Internet access and broadband technology are vital to economic development and job creation.

The forum is expected to draw approximately 100 people, including government representatives and key IT managers in Romanian Ministries, education officials and advisors, local IT leaders and private-sector CEOs from Romania’s largest companies. 

Barrett’s current trip to Europe is expected to be his last as an ambassador for the Intel World Ahead Program. He announced in January an intention to retire from his role as Intel’s chairman in May. 

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. 

Through its World Ahead Program, Intel strives to improve education, health care, entrepreneurship and government services in developing countries worldwide by accelerating access to computers, connectivity and localized Internet content. Additional information is available at www.intel.com/changingtheworld and www.intel.com/intel/worldahead. 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries. 

* Other names and brands may be claimed as the property of others.

News Source: Intel 

Seoul (Korea Newswire) March 05, 2009 08:39 AM — Intel Corporation today announced the 26 companies receiving Intel’s Preferred Quality Supplier (PQS) award for commitment to quality and performance excellence in 2008. These suppliers exceeded high expectations and tough performance goals to distinguish themselves from the thousands of suppliers that work with Intel. 

Winners of the PQS award include: 

AceCo Precision Manufacturing; Asyst Technologies, Inc.; Cisco Systems, Inc.; Dow Corning Corporation; FUJIFILM Electronic Materials; Ibiden Co., Ltd.; KES System & Service (1993) Pte Ltd.; Linde Electronics, a Member of the Linde Group; Murata Manufacturing Co., Ltd.; Nan Ya Printed Circuit Board Corporation; Nippon Mining & Metals Co., Ltd.; Praxair Electronics; Richtek Technology Corporation; Rofin-Baasel; Rosendin Electric; Securitas Security Services USA, Inc.; Senju Metal Industry Co., Ltd.; Skanska; Tektronix, Inc.; Thermal Product Solutions, a Division of SPX Corporation; Tokyo Electron Limited; TriQuint Semiconductor, Inc.; Tyco Electronics; Verizon Business; VWR International, LLC; and Xstrata Recycling, Inc. 

“The standard by which companies are measured to be considered world-class quality continues to rise,” said Craig Brown, vice president of Intel’s Technology and Manufacturing Group and director of Materials. “Companies must not only achieve ever-improving traditional measures of product quality, but they must also understand and mitigate their impact on the environment. This year’s recipients of the Preferred Quality Supplier award have risen to this new level of challenge in their respective industries and have also shown their ongoing commitment to build an affordable, innovative and agile supply chain. We are pleased to work with these role models.” 

“The excellence demonstrated by Intel’s top performing suppliers is truly remarkable,” said Robert Bruck, vice president of Intel’s Technology and Manufacturing Group and general manager of Technology Manufacturing Engineering. “The enduring commitment to industry-leading innovation, affordability and speed separates these suppliers from their peers and is critical to delivering increased value to our customers.” 

The PQS award is part of Intel’s Supplier Continuous Quality Improvement program, which encourages suppliers to strive for excellence and continuous improvement. To qualify for PQS status, suppliers must score 80 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and responsiveness goals. Suppliers must manage and deliver on a challenging improvement plan and a quality/business systems assessment. Furthermore, the 2008 recipients demonstrated basic compliance to the Electronic Industry Code of Conduct and Intel’s Green Sustainability Program. Additional information about the SCQI program is available at supplier.intel.com/quality/scqi.htm. 

Recognition events will be held in Tokyo and Santa Clara, Calif. this month to honor the PQS award winners. In addition, there will be an online advertisement launch and acknowledgement on Intel’s corporate Web site. 

The PQS winners provide Intel with the following products and services: 

AceCo Precision Manufacturing supplies fab spares and refurbishment 
Asyst Technologies, Inc. supplies automated material handling systems 
Cisco Systems, Inc. supplies networking hardware infrastructure, IP telephony and enterprise collaboration products 
Dow Corning Corporation supplies electronic adhesives 
FUJIFILM Electronic Materials supplies advanced chemistry and equipment for semiconductor device manufacturing 
Ibiden Co., Ltd. supplies flip-chip substrate packages 
KES System & Service (1993) Pte Ltd. supplies burn-in boards, TIUs, and BIB/TIU/UBID maintenance 
Linde Electronics, a Member of the Linde Group, supplies ultra-high purity gases and chemicals and onsite services
Murata Manufacturing Co., Ltd. supplies multilayer ceramic capacitors, inductors, ferrite beads and wireless modules 
Nan Ya Printed Circuit Board Corporation supplies substrates and printed circuit boards 
Nippon Mining & Metals Co., Ltd. supplies sputtering targets for physical vapor deposition applications 
Praxair Electronics supplies electronic process and bulk gases, sputtering targets and spare parts management 
Richtek Technology Corporation provides power management solutions 
Rofin-Baasel supplies laser mark equipment 
Rosendin Electric provides electrical construction services 
Securitas Security Services USA, Inc. provides security services 
Senju Metal Industry Co., Ltd. supplies soldering materials 
Skanska provides construction management 
Tektronix, Inc. supplies validation test equipment 
Thermal Product Solutions, a Division of SPX Corporation, supplies epoxy curing, IHS and pre-bake ovens 
Tokyo Electron Limited supplies semiconductor production equipment 
TriQuint Semiconductor, Inc. supplies amplifiers, RF switches and front end module for WLAN products 
Tyco Electronics supplies CPU sockets, connectors and passive components 
Verizon Business supplies network telecommunications and cellular services 
VWR International, LLC provides distribution of global sourcing and supply chain management solutions 
Xstrata Recycling, Inc. provides HVI component scrap processing 

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries. 

* Other names and brands may be claimed as the property of others.

News Source: Intel 

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