Asian Semiconductor

Seoul (Korea Newswire) March 05, 2009 08:40 AM — Intel Corporation Chairman Craig Barrett today made an impassioned speech on education to Romanian university students, telling them that education and technology are key to creating an innovation economy. Barrett is also collaborating with government officials on ways to broaden the use of computers and other technology to enhance national education. 

“Integrating computers and education is essential in the 21st century,” said Barrett, who also chairs the United Nations Global Alliance for Information and Communication Technologies and Development. “The new technologies and trends that are transforming the global economy will influence the future of today’s students, both personally and professionally.” 

Barrett delivered his address at one of Romania’s most prestigious institutions of higher education. The nearly 200-year-old University Politehnica of Bucharest (UPB), with 26,000 students, is the country’s largest technical university. Speaking to students from information technology departments as well as professors from Bucharest universities, Barrett encouraged listeners to broaden their options for the future by learning as much as they can with the help of information and communications technology (ICT). 

In related events, UPB bestowed the honorary title of Doctor Honoris Causa on Barrett today during a special ceremony at the university. The honor recognizes Barrett’s intellectual merits, and is the highest degree that UPB awards to any individual. 

Barrett is also scheduled to meet with government officials today to discuss how Intel can support the Romanian government’s plan to strengthen its strategy for technology-assisted education. One existing effort is the Intel® Teach program, which is designed to enhance classroom learning by training teachers to integrate technology into the curriculum. Intel teamed with Romanian software developer SIVECO to help administer the training and expects that 35,000 Romanian teachers will complete the Intel Teach program in the coming years. 

The Intel chairman planned to end his day with the local American Chamber of Commerce at a forum at the National Museum of Art of Romania. Barrett is expected to talk about how Romania can take advantage of ICT to be competitive as one of the newest members of the European Union. He believes investments in ICT infrastructure deployment such as Internet access and broadband technology are vital to economic development and job creation.

The forum is expected to draw approximately 100 people, including government representatives and key IT managers in Romanian Ministries, education officials and advisors, local IT leaders and private-sector CEOs from Romania’s largest companies. 

Barrett’s current trip to Europe is expected to be his last as an ambassador for the Intel World Ahead Program. He announced in January an intention to retire from his role as Intel’s chairman in May. 

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. 

Through its World Ahead Program, Intel strives to improve education, health care, entrepreneurship and government services in developing countries worldwide by accelerating access to computers, connectivity and localized Internet content. Additional information is available at www.intel.com/changingtheworld and www.intel.com/intel/worldahead. 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries. 

* Other names and brands may be claimed as the property of others.

Seoul (Korea Newswire) March 05, 2009 08:39 AM — Intel Corporation today announced the 26 companies receiving Intel’s Preferred Quality Supplier (PQS) award for commitment to quality and performance excellence in 2008. These suppliers exceeded high expectations and tough performance goals to distinguish themselves from the thousands of suppliers that work with Intel. 

Winners of the PQS award include: 

AceCo Precision Manufacturing; Asyst Technologies, Inc.; Cisco Systems, Inc.; Dow Corning Corporation; FUJIFILM Electronic Materials; Ibiden Co., Ltd.; KES System & Service (1993) Pte Ltd.; Linde Electronics, a Member of the Linde Group; Murata Manufacturing Co., Ltd.; Nan Ya Printed Circuit Board Corporation; Nippon Mining & Metals Co., Ltd.; Praxair Electronics; Richtek Technology Corporation; Rofin-Baasel; Rosendin Electric; Securitas Security Services USA, Inc.; Senju Metal Industry Co., Ltd.; Skanska; Tektronix, Inc.; Thermal Product Solutions, a Division of SPX Corporation; Tokyo Electron Limited; TriQuint Semiconductor, Inc.; Tyco Electronics; Verizon Business; VWR International, LLC; and Xstrata Recycling, Inc. 

“The standard by which companies are measured to be considered world-class quality continues to rise,” said Craig Brown, vice president of Intel’s Technology and Manufacturing Group and director of Materials. “Companies must not only achieve ever-improving traditional measures of product quality, but they must also understand and mitigate their impact on the environment. This year’s recipients of the Preferred Quality Supplier award have risen to this new level of challenge in their respective industries and have also shown their ongoing commitment to build an affordable, innovative and agile supply chain. We are pleased to work with these role models.” 

“The excellence demonstrated by Intel’s top performing suppliers is truly remarkable,” said Robert Bruck, vice president of Intel’s Technology and Manufacturing Group and general manager of Technology Manufacturing Engineering. “The enduring commitment to industry-leading innovation, affordability and speed separates these suppliers from their peers and is critical to delivering increased value to our customers.” 

The PQS award is part of Intel’s Supplier Continuous Quality Improvement program, which encourages suppliers to strive for excellence and continuous improvement. To qualify for PQS status, suppliers must score 80 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and responsiveness goals. Suppliers must manage and deliver on a challenging improvement plan and a quality/business systems assessment. Furthermore, the 2008 recipients demonstrated basic compliance to the Electronic Industry Code of Conduct and Intel’s Green Sustainability Program. Additional information about the SCQI program is available at supplier.intel.com/quality/scqi.htm. 

Recognition events will be held in Tokyo and Santa Clara, Calif. this month to honor the PQS award winners. In addition, there will be an online advertisement launch and acknowledgement on Intel’s corporate Web site. 

The PQS winners provide Intel with the following products and services: 

AceCo Precision Manufacturing supplies fab spares and refurbishment 
Asyst Technologies, Inc. supplies automated material handling systems 
Cisco Systems, Inc. supplies networking hardware infrastructure, IP telephony and enterprise collaboration products 
Dow Corning Corporation supplies electronic adhesives 
FUJIFILM Electronic Materials supplies advanced chemistry and equipment for semiconductor device manufacturing 
Ibiden Co., Ltd. supplies flip-chip substrate packages 
KES System & Service (1993) Pte Ltd. supplies burn-in boards, TIUs, and BIB/TIU/UBID maintenance 
Linde Electronics, a Member of the Linde Group, supplies ultra-high purity gases and chemicals and onsite services
Murata Manufacturing Co., Ltd. supplies multilayer ceramic capacitors, inductors, ferrite beads and wireless modules 
Nan Ya Printed Circuit Board Corporation supplies substrates and printed circuit boards 
Nippon Mining & Metals Co., Ltd. supplies sputtering targets for physical vapor deposition applications 
Praxair Electronics supplies electronic process and bulk gases, sputtering targets and spare parts management 
Richtek Technology Corporation provides power management solutions 
Rofin-Baasel supplies laser mark equipment 
Rosendin Electric provides electrical construction services 
Securitas Security Services USA, Inc. provides security services 
Senju Metal Industry Co., Ltd. supplies soldering materials 
Skanska provides construction management 
Tektronix, Inc. supplies validation test equipment 
Thermal Product Solutions, a Division of SPX Corporation, supplies epoxy curing, IHS and pre-bake ovens 
Tokyo Electron Limited supplies semiconductor production equipment 
TriQuint Semiconductor, Inc. supplies amplifiers, RF switches and front end module for WLAN products 
Tyco Electronics supplies CPU sockets, connectors and passive components 
Verizon Business supplies network telecommunications and cellular services 
VWR International, LLC provides distribution of global sourcing and supply chain management solutions 
Xstrata Recycling, Inc. provides HVI component scrap processing 

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries. 

* Other names and brands may be claimed as the property of others.

Seoul (Korea Newswire) March 04, 2009 06:19 PM — The DRAM industry has faced two years of downturn - the global financial crisis which started from 2H08, and the freezing demand. According to DRAMeXchange, Q408 DRAM chip price dropped more than 54% and DRAM vendors had to deal with severe cash outflow pressure. The immediate adoption of a newly developed process technology by DRAM vendors is no longer being witnessed. Even though the new technology can be immediately induced to mass production, DRAM vendors are now observing the global DRAM market supply and demand situation and evaluate their own CAPEX. They are also considering the cost of equipment investment and future amortization issues. 

The development of 5x nm process represents a more rational investment by DRAM vendors. According to the roadmaps of DRAM technology providing vendors, the 50 nm mass production schedule might be delayed one to two quarters but the development progress of the 5x nm process by the varying DRAM vendors are proceeding well. Comparing to the 6x nm process, the gross die of DDR3 1Gb chip is 40% or even 50% more than the DDR2. The cost per chip could decrease 20% to 30% (including packaging and testing) but the investment amount needed for equipments is higher than the 70 nm or 60 nm process. This is the main reason that dragged the schedule of 5x nm process migration. The 50 nm process requires immersion tools is because the line width of 50 nm process is narrower than the 60 nm, the current yellow light equipment can not meet the needs of the 50 nm process. But the immersion tool is pricing at one to two billion USD, the current 100K 12 inch capacity requires five to seven equipments. The cost of the equipments is quite big a burden of the DRAM vendors who are currently short of cash. How to use the current equipments to shrink the die size and appropriately invest in 50 nm process equipments instead of full throttle switching to immersion tools are tests and a matter of life or death to the DRAM vendors.

eoul (Korea Newswire) March 03, 2009 08:40 AM — Intel Corporation Chairman Craig Barrett today urged the tech industry and nations to “innovate and invest” to spur economic development and solve global challenges. 

Calling innovation and technology “the backbone of the modern economy,” Barrett told an audience at CeBIT 2009 that investments in information and communications technology (ICT) will help ensure economic prosperity as the world undergoes a digital transformation. 

“There are three gauges nations can tune to compete,” said Barrett as he kicked off the world’s largest technology trade show. “Investing in good education produces smart people. Investing in research and development produces smart ideas. And, creating the right environment in which smart people can develop smart ideas. These steps would stimulate economic growth, jobs and new opportunities including future collaborations among private industry, government and academia.” 

Barrett’s conclusions are drawn from observations visiting more than 30 countries a year as a “technology ambassador” and as chairman of the United Nations Global Alliance for ICT and Development. Countries that invest wisely in technology are better equipped to deal with those challenges, he said, while countries that ignore or delay such investments are increasingly likely to find themselves at a global disadvantage. 

“In the current global economic climate, thinking long-term is more important than ever,” Barrett said. “Today, we can lay the groundwork for growth. Many nations and businesses try to save their way out of a recession. It is much better to invest our way out.” 

Barrett believes that investing in new ideas and inventions not only stimulates job creation, but also increases productivity, leads to new forms of energy and smarter energy consumption, improves health care and medicines, and gives consumers more benefits for less cost. 

Barrett stressed the need to invest in education as the foundation of a strong economy, especially as developed nations shift from production societies to knowledge-based ones. He also said developing countries can build on that foundation by accelerating the use of computers, the Internet and other technologies in classrooms so young people are prepared to compete for careers in the 21st century. 

Investments in education are especially imperative given that more than 75 million primary-age children throughout the developing world are not in school and need help getting an education, according to Barrett. 

One of the most successful ways that Intel invests in education, Barrett noted, is through the Intel® Teach program, which is designed to enhance classroom learning by training teachers to integrate technology into the curriculum. In Europe, nearly 1 million teachers have completed the Intel Teach training to date. In Germany alone, half of all teachers have been trained through the program, which is offered in every German state, and 89 percent of teachers report that they are making use of technology in the classroom as a result of their training. 

“Nothing beats investing in good people and good ideas,” Barrett told the CeBIT audience. He added that government and business partnerships are fundamental in driving solutions and confronting global challenges. 

Currently in its 23rd year, CeBIT is the world’s largest conference showcasing solutions for the world of IT and telecommunications. The 6-day event is expected to draw exhibitors from more than 75 countries and nearly half a million visitors from all over the world. 

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. 

Through its World Ahead Program, Intel strives to improve education, health care, entrepreneurship and government services in developing countries worldwide by accelerating access to computers, connectivity and localized Internet content. Additional information is available at www.intel.com/changingtheworld and www.intel.com/intel/worldahead/index.htm. 

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries. 

* Other names and brands may be claimed as the property of others.

Intel to port Atom CPU cores to TSMC’s technology platform to expand market for Atom Processors SoC Customers

Issued by: TSMC

Issued on: 2009/03/02

Santa Clara, CA & Hsin-chu, Taiwan, March 2, 2009 – Intel Corporation and TSMC today announced a memorandum of understanding (MOU) to collaborate on addressing technology platform, intellectual property (IP) infrastructure, and System-on-Chip (SoC) solutions. Under the MOU, Intel would port its Atom processor CPU cores to the TSMC technology platform including processes, IP, libraries, and design flows. The collaboration is intended to expand Intel’s Atom SoCs availability for Intel customers for a wider range of applications through integration with TSMC’s diverse IP infrastructure.

This MOU is an important step in a long-term strategic technology cooperation between Intel and TSMC. With this joint effort, Intel intends to significantly broaden the market opportunities for its Intel Atom SoCs and accelerate deployment of the architecture through multiple SoC implementations. At the same time, TSMC extends its technology platform to serve the Intel Architecture market segments.

“We believe this effort will make it easier for customers with significant design expertise to take advantage of benefits of the Intel Architecture in a manner that allows them to customize the implementation precisely to their needs,” said Paul Otellini, Intel president and CEO. “The combination of the compelling benefits of our Atom processor combined with the experience and technology of TSMC is another step in our long-term strategic relationship.”

“TSMC values our strategic relationship with Intel. This MOU brings together the Intel Architecture and the TSMC technology platform. We expect this collaboration will help proliferate the Atom processor SoC and foster overall semiconductor growth,” said Dr. Rick Tsai, president and CEO of TSMC. “With this agreement, our technology platform extends beyond the two companies’ current collaboration to support future Intel embedded x86 products.”

The Intel Atom processor features 47 million transistors and is Intel’s smallest processor. Products manufactured through the agreement may find adoption in embedded CPU market segments such as mobile internet Devices (MIDs), smart-phones, netbooks, nettops, and AC-powered consumer electronics device. The processor is designed to bring the whole Internet and the benefits of computing to an emerging class of consumer-friendly devices.

About Intel

Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.

About TSMC

TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company’s total managed capacity in 2008 exceeded 9 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch - GIGAFABs ™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit www.tsmc.com.