Asian Semiconductor

www.AsianSemiconductor.com/ AsianSemi.com

Seoul, Korea - February 4, 2009 : Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has developed and validated the first 40-nanometer (nm) class DRAM chip and module. This new 1-Gigabit DDR2 component (x8) and a corresponding 1-Gigabyte 800Mbps (Megabits per second) DDR2 SODIMM (small outline DRAM inline memory module) - both to be processed at 40-nm - have been certified in the Intel Platform Validation program for use with the Intel® GM45 series 750809090204_40nm_ddr2_lExpress mobile chipsets.

“Securing extremely advanced technology and system/platform validated operability underscores our commitment as technology leader to deploying the most efficient means of producing DRAM in the marketplace,” said Kevin Lee, vice president, technical marketing, Samsung Semiconductor, Inc.

The migration to 40-nm class process technology is expected to accelerate the time-to-market cycle by 50 percent - to just one year. Samsung plans to apply its 40-nm class technology to also develop a 2Gb DDR3 device for mass production by the end of 2009.

The new 40-nm class process technology will drive further reductions in voltage against a 50-nm class device, which Samsung expects to translate into about a 30 percent power savings.

The finer DRAM technology node also delivers an approximately 60 percent increase in productivity over 50-nm class process technology.

In addition, Samsung expects that its 40-nm process node will mark a significant step toward the development of next generation, ultra-high performance DRAM technologies such as DDR4.

SEOUL, Korea — On February 23, 2009, the United States District Court for the Northern District of California denied Rambus’s request for an injunction barring Hynix from selling its DRAM products in the United States. The order also finalizes a prior ruling awarding damages to Rambus and imposes royalties of 1% on SDR SDRAM and 4.25% on DDR SDRAM and later generations of DRAMs sold in the United States before the final judgment. Hynix and Rambus were ordered to negotiate over royalty rates for sales after the date of final judgment.

Hynix expects that a final judgment reflecting this order will be entered soon.

Hynix is gratified that the court rejected Rambus’s request for an injunction, but is disappointed by the district court’s damages ruling and will file an appeal when the final judgment is entered. Hynix believes that Rambus’s patents, as has been recently confirmed by certain rulings of the US Patent & Trademark Office, are invalid. In addition, Hynix maintains that Rambus’s conduct in destroying evidence relevant to the litigation between Hynix and Rambus, and Rambus and the rest of the DRAM industry, bars Rambus from enforcing its patents. The United States District Courts for Delaware and Virginia have already ruled that Rambus is guilty of destroying evidence; the decision of the California court conflicts with these other court decisions.

While Hynix’s appeal is pending Hynix is not required to pay the judgment; if, as it expects, Hynix prevails on the appeal, the judgment will be reversed. The appeal will take 1 to 2 years under the normal U.S legal procedure.

Hynix’s US sales of DRAMs will continue uninterrupted.

While the appeal is pending Hynix anticipates that the direct damage under the district court’s ruling will not be substantial and will be greatly dependent on the results of the appeal.

Hynix will continue to do its best to obtain a favorable decision from the appellate court.

About Hynix Semiconductor Inc.

Hynix Semiconductor Inc. (HSI) of Icheon, Korea, is the world’s top tier memory semiconductor supplier offering Dynamic Random Access Memory chips (“DRAMs”) and Flash memory chips to a wide range of established international customers. The Company’s shares are traded on the Korea Stock Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about Hynix is available at www.hynix.com

 

Seoul, Korea - February 12, 2009 : Samsung Electronics Co., Ltd., the world leader in advanced memory technology and the leading producer of high-end graphics memory, announced today that it has begun mass producing GDDR5 graphics memory using 50-nanometer class process technology.  

“Our early 2009 introduction of GDDR5 chips will help us to meet the growing demand for higher performance graphics memory in PCs, graphic cards and game consoles,” said Mueez Deen, director, mobile and graphics memory, Samsung Semiconductor, Inc. “Because GDDR5 is the fastest and highest performing memory in the world, we’re able to improve the gaming experience with it across all platforms,” he added

Designed to support a maximum data transfer speed of 7.0Gbps, Samsung’s GDDR5 will render more life-like (3D) imaging with a maximum 28GB/s bandwidth, which is more than twice that of the previous fastest graphics memory bandwidth of 12.8GB/s for GDDR4. The ultra-fast processing speed is equivalent to transferring nineteen 1.5GB DVD resolution movies in one second. The high image processing speed of the GDDR5 also supports the latest data formats (Blu-ray and full HD).

Unlike GDDR4, which processes data and images using the strobe-and-clock technique, the processing speed of the GDDR5 is much faster because it operates with a free-running clock that does not require the data read/write function to be synchronized to the operations of the clock.
,br /> By adopting 50nm class technology, Samsung expects production efficiency to rise 100 percent over 60nm class technology. In addition, Samsung’s GDDR5 operates at 1.35 volts (V), which represents a 20 percent reduction in power consumption compared to the 1.8V at which GDDR4 devices operate.

Now available in a 32Megabit (Mb) x32 configuration and also configurable as a 64Mb x16 device, Samsung expects GDDR5 to account for over 20 percent of the total graphic memory market in 2009. The company also said it plans to expand the 50-nm process technology throughout its graphics memory line-up this year. 

IMID 2009 booth application will be available from March 2009.

IMID is  a only one exhibition for display industry ( modules, equipment, materials and cleanroom supplies ect  )of Korea

More information at: http://www.imidex.org/english/2009/

 

IMID 2008 Gallery.

 I-SEDEX Gallery.

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